Semiconductor Module – Enables the detailed analysis of semiconductor device operations at the fundamental physics level allowing for the modeling of PN junctions, bipolar transistors, MOSFETs, MESFETs, thyristors, and Schottky diodes.This includes such applications as mass spectrometers, semiconductor processing, satellite technology, particle accelerators, shale gas exploration, and flow in nanoporous materials. Molecular Flow Module – Offers the capability to simulate rarefied gas flow in complex CAD geometries of vacuum systems.Wave Optics Module – Allows users to analyze electromagnetic wave propagation in optically large structures, such as optical fibers and sensors, bidirectional couplers, plasmonic devices, metamaterials, laser beam propagation, and non-linear optical components. Transitional and rotational displacements, as well as locking, can be simulated for a variety of joint types, including prismatic, hinge, cylindrical, screw, planar, ball, slot, and reduced slot joints. Multibody Dynamics Module – Provides users with the ability to analyze the assembly of rigid and flexible bodies.With the introduction of the five new modules, users in key application areas from major industries now have access to the new modeling and simulation tools offered by COMSOL. These types of materials are used as passive coolers for flat screens and smart phones. Simulation results reveal highly directed heat conduction through the material with heat originating at the center disk. A model of an anisotropic s-shaped material was generated using the automated curvilinear coordinates feature in COMSOL Multiphysics. The latest version of COMSOL Multiphysics, version 4.3b, introduces five new application-specific modules and expanded modeling and analysis tools. COMSOL announced the release of major new additions to the COMSOL simulation platform.
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